| 當(dāng)前位置：首頁->方案設(shè)計(jì) |
|
| HybridPACK 2混合動(dòng)力汽車電源模塊解決方案 |
|
|
| 文章來源： 更新時(shí)間：2015/2/9 10:06:00 |
在線咨詢： |
| |
Infineon公司的HybridPACK 2是設(shè)計(jì)用于混合動(dòng)力和電動(dòng)汽車的汽車級(jí)電源模塊,連續(xù)功率高達(dá)100kW,工作結(jié)溫150°C,采用Trench-Field-Stop IGBT3三相六組配置,芯片的最大額度是800A/650V,主要用于混合動(dòng)力和電動(dòng)汽車的馬達(dá)和/或電機(jī)逆變器,和汽車電子應(yīng)用.
本文介紹了HybridPACK™ 2主要特性, 應(yīng)用框圖, HybridPACK™ 2混合模塊驅(qū)動(dòng)板主要特性,框圖,電路圖,材料清單和模塊器件裝配圖以及HybridPACK™ 2混合模塊邏輯板v1.2和v1.3b主要特性,框圖,電路圖,材料清單和模塊器件裝配圖.
Infineon’ HybridPACK™ 2 is an automotive qualified power module designed for Hybrid- and Electric Vehicle applications from a power range up to 100kW continuous power. Designed for a 150°C junction operation temperature, the module accommodates a 3-phase Six-Pack configuration of Trench-Field-Stop IGBT3 and matching emitter controlled diodes. Maximum chip ratings are 800A/650V.
The HybridPACK™ 2 power module is based on Infineon’s leading IGBT Trench- Field-Stop Technology, which offers lowest conduction and switching losses.
The HybridPACK™ 2 power module is built on Infineon’s long time experience in the development of IGBT power modules, intense research efforts of new material combinations and assembly technologies.
Based on the usage of modern power semiconductor chips, Infineon has developed -dedicated for xEV - this HybridPACK™ 2 power module as a part of the HybridPACK™ family for automotive applications.
The HybridPACK™ 2 comes with a Pin-Fin baseplate for direct liquid cooling which significantly improves the thermal cycles capability and extends the lifetime of the power module. The Pin-Fin baseplate with its excellent cooling properties enables a very high power density of the HybridPACK™ 2 package.
The high-performance ceramic substrate (DCB) and Infineon’s enhanced wire-bonding process provides unparalleled thermal and power cycling capability leading to highest reliability for xEV inverter applications. For a compact design the driver stage PCB can be connected on the top of the module.All power connections are realized with screw terminals.
The HybridKIT 2 Evaluation Kit offers a complete inverter reference system with driverand control-board, heatsink, DC-Link capacitor and software enabling a fast application design.
All modules from the HybridPACK™ family are dedicated for automotive applications with highest power density and efficiency. Built in accordance with Infineon’s automotive excellence program, this fully automotive qualified HybridPACK™ 2 sets the quality and reliability standards for power modules in hybrid and electric vehicles.
HybridPACK™ 2主要特性:
„„Complete 3-phase six pack with NTC
„„650V Trench-Field-Stop IGBT3 with matching emitter controlled diode
„„Extended temperature range
–– Tjop = 150℃
–– Tjmax = 175℃
„„Current rating up to 800A DC
„„Rugged Al2O3 ceramic for automotive applications
„„Pin-Fin baseplate for direct cooling
„„Fully automotive qualified Benefits
„„Cost efficient system approach
„„High efficiency due to low power losses
„„High reliability
„„Compact design
„„HybridKIT 2 reference design available
„„Very high power density
HybridPACK™ 2應(yīng)用:
„„Motor and/or generator inverter for Hybrid- and Electric Vehicles and Range Extenders
(up to 100kW continuous)
„„Rugged ceramic substrate for automotive applications
圖1. HybridPACK™ 2應(yīng)用框圖
The Hybrid Kit for HybridPACK™2 was developed to support customers during their first steps in designing applications with HybridPACK™2 IGBT module.
圖2. HybridPACK™ 2混合模塊外形圖
The Hybrid Kit for HybridPACK™2 is made up of two PCBs (Driver Board and Logic Board) mechanically and electrically suitable to be used with an IGBT Module HybridPACK™2 (included), a DC-bus capacitor and a cooler.All these components build a complete main inverter for (H)EV applications up to 80kW.
HybridPACK™ 2混合模塊主要特性:
• Complete main inverter for (H)EV applications up to 80kW
• Automotive qualified IGBT module HybridPACK™2
– 650V/800A IGBT & Diode chipset
• Automotive qualified Driver IC 1ED020I12-FA
– Based on coreless transformer technology
– Up to 1200V and 2A driving capability
– VCE sat - detection
• TriCore™ family 32-bit microcontroller TC1767: member of the AUDO FUTURE product family designed for automotive applications
• Possibility of usage of different motor position interfaces: encoder, resolver, GMR (Giant Magneto-Resistance) or hall sensor
圖3. HybridPACK™ 2混合模塊框圖
HybridPACK™ 2混合模塊驅(qū)動(dòng)板主要特性:
• Six channel IGBT driver
• Electrically and mechanically suitable for 650 V IGBT Module HybridPACK™2
• Includes DC/DC power supply
• Isolated voltage measurement
• Short circuit protection with toff < 6 μs
• Undervoltage lockout of IGBT driver IC
• Positive logic with 5 V CMOS level for PWM and Fault signals
• One fault output signal for each leg and one common for all legs
圖4. HybridPACK™ 2混合模塊驅(qū)動(dòng)板外形圖:安裝在HybridPACK™ 2模塊上.
圖5. HybridPACK™ 2混合模塊驅(qū)動(dòng)板尺寸圖
圖6. HybridPACK™ 2混合模塊驅(qū)動(dòng)板框圖
圖7. HybridPACK™ 2混合模塊驅(qū)動(dòng)板電路圖(1):框圖
圖8. HybridPACK™ 2混合模塊驅(qū)動(dòng)板電路圖(2):SMPS電源
圖9. HybridPACK™ 2混合模塊驅(qū)動(dòng)板電路圖(3):外接連接器
圖10. HybridPACK™ 2混合模塊驅(qū)動(dòng)板電路圖(4):故障邏輯
圖11. HybridPACK™ 2混合模塊驅(qū)動(dòng)板電路圖(5):輸入邏輯
圖12. HybridPACK™ 2混合模塊驅(qū)動(dòng)板電路圖(6):IGBT驅(qū)動(dòng)器-U相底部晶體管
圖13. HybridPACK™ 2混合模塊驅(qū)動(dòng)板電路圖(7):IGBT模塊
圖14. HybridPACK™ 2混合模塊驅(qū)動(dòng)板電路圖(8):DC電壓測(cè)量
圖15. HybridPACK™ 2混合模塊驅(qū)動(dòng)板電路圖(9):IGBT模塊溫度測(cè)量
圖16. HybridPACK™ 2混合模塊驅(qū)動(dòng)板裝配圖:頂層(1)
圖17. HybridPACK™ 2混合模塊驅(qū)動(dòng)板裝配圖:頂層(2)
圖18. HybridPACK™ 2混合模塊驅(qū)動(dòng)板裝配圖:底層(1)
圖19. HybridPACK™ 2混合模塊驅(qū)動(dòng)板裝配圖:底層(2)
HybridPACK™ 2混合模塊驅(qū)動(dòng)板材料清單:
圖20. HybridPACK™ 2混合模塊邏輯板v1.2外形圖
圖21. HybridPACK™ 2混合模塊邏輯板v1.3b外形圖
圖22. HybridPACK™ 2混合模塊邏輯板框圖
圖23. HybridPACK™ 2混合模塊邏輯板v1.2電路圖:框圖
圖24. HybridPACK™ 2混合模塊邏輯板v1.3b電路圖:框圖
圖25. HybridPACK™ 2混合模塊邏輯板v1.2電路圖:電源
圖26. HybridPACK™ 2混合模塊邏輯板v1.3b電路圖:電源:
圖27. HybridPACK™ 2混合模塊邏輯板v1.3b和v1.2電路圖:JTAG調(diào)試連接器
 
圖28. HybridPACK™ 2混合模塊邏輯板v1.2電路圖:看門狗
圖29. HybridPACK™ 2混合模塊邏輯板v1.3b電路圖:看門狗
圖30.HybridPACK™ 2混合模塊邏輯板v1.2電路圖: 編碼器邏輯
圖31.HybridPACK™ 2混合模塊邏輯板v1.3b電路圖:編碼器邏輯
圖32.HybridPACK™ 2混合模塊邏輯板v1.2電路圖:電平轉(zhuǎn)移
圖33.HybridPACK™ 2混合模塊邏輯板v1.3b電路圖:電平轉(zhuǎn)移
圖34.HybridPACK™ 2混合模塊邏輯板v1.2和v1.3b電路圖:驅(qū)動(dòng)板連接器
圖35.HybridPACK™ 2混合模塊邏輯板v1.2電路圖:MCU邏輯板
圖36.HybridPACK™ 2混合模塊邏輯板v1.3b電路圖:MCU邏輯板
圖37.HybridPACK™ 2混合模塊邏輯板v1.2電路圖:輸入邏輯板
圖38.HybridPACK™ 2混合模塊邏輯板v1.3b電路圖:輸入濾波器邏輯板
圖39.HybridPACK™ 2混合模塊邏輯板v1.2電路圖:MCU TC1767引腳邏輯板
圖40.HybridPACK™ 2混合模塊邏輯板v1.3b電路圖:MCU TC1767引腳邏輯板
圖41.HybridPACK™ 2混合模塊邏輯板v1.2和v1.3b電路圖:EEPROM
圖42.HybridPACK™ 2混合模塊邏輯板v1.3b電路圖:板上溫度測(cè)量
圖43.HybridPACK™ 2混合模塊邏輯板v1.2裝配圖:頂層
圖44.HybridPACK™ 2混合模塊邏輯板v1.3b裝配圖:頂層
圖45.HybridPACK™ 2混合模塊邏輯板v1.2裝配圖:底層
圖46.HybridPACK™ 2混合模塊邏輯板v1.3b裝配圖:底層
HybridPACK™ 2混合模塊邏輯板v1.2材料清單:
HybridPACK™ 2混合模塊邏輯板v1.3b材料清單:
 |
| |
|
|
|
|
|
| |
|
| |
|
|
